1. Program Objective

Summary of the Program Objectives and the Expected Output for the Semiconductor (SC) Process Data Exchange Milestone Program.

2. Assumptions, Preconditions, or Dependencies

Enable foundry and other inline process partners to deliver semiconductor process  and assembly data to customers and to other data consumers including chip designers. The purpose is to gain efficiencies by defining a common vocabulary and structure for the transmission of process and assembly data. This standard will help reduce design development time and improve product manufacturability by providing standardized data in a commonly understood manner.

3. Specification Development Effort Scope - IN SCOPE

Specification Development Effort Scope

1)     Define and document requirements to support the sending of process and assembly result information to a trading partner for the following semiconductor processes :

a.      Inline Process Data:  Data that is taken a various stages of the semiconductor manufacturing process which  may include measuring film thickness, overlay/alignment, and critical dimensions.  The process data transferred between trading partners is contractually negotiated .

b.      Assembly Yield Process Data: Data that is taken during the assembly process which includes yield data during optical inspections,  singulation (e.g wafer saw yield, punch yield),  shear and pull data  for wirebond and C4 processing on various package types and final inspection yield.  Incoming wafer lot id and assembly lot id information is associated.  Assembly yield data transferred between the trading partners is contractually negotiated . 

2)     Define, document and align a common vocabulary for sending semiconductor process and assembly process data .

3)     Validate and implement the PIP with multiple partners .

4. Specification Development Effort Scope - OUT OF SCOPE

The program scope DOES NOT include plans to:

·         Define the process of acquiring or aggregating the process data

·       Define and document the exchange of data for the following business process areas : 

-        Defect Data: defect classification, PLY (Photo Limited Yield)

-        FCS (Floor Control System) or MES (Manufacturing Execution System) Logistics: wafer history/operation, tools, recipes, rework, holds .

-        Collection of encapsulation, and x-ray inspection data from the assembly process.

-        Collection of binary data from optical inspection.

-        Collection of critical dimension images from measurement tools.

-        Define a business acknowledgement reply for the reception of the data (e.g. business contact acknowledgement such as e-mail.)

-        Redefine or develop any vocabularies or formats already existing in the market today that can be used by RosettaNet

5. Specification Development Expected Output

o        Specification Requirements Documents for exchanges defined in the scope description

o        eBusiness Process Description for each expected PIP as well as one for the overall data exchange process

6. Documentation and Implementation Support Expected Output  

The supporting business and technical documentation to be developed by the program include:

-        RosettaNet Implementation Guide (RIG)

Include any known relationships or dependencies to other working groups or RosettaNet specifications:

-        RosettaNet Technical Dictionary (RNTD)